Text Box: How far can copper interconnects be extended for silicon circuits?

 

 

 

 

      

                                                         Graduate Student: Rebekah Graham

 

Text Box: Fabrication of copper interconnects with sub-50nm dimensions to demonstrate extendibility

 

 

 

25nm vias
 

 

Current 65nm technologies use copper interconnects with dimensions of 90nm

Our laboratory is fabricating interconnect structures with 30nm dimension

 

Three generations beyond current technologies: Questions….

     Will the resistivity of copper be limited by mesoscopic scattering effects?

     Can copper grains grow in sub-50nm structures?

     Will eltromigration reliability be degraded?

     Will stress gradients exceed the yield stress of the interconnect layers?

 

More information:galers@ucsc.edu